MEAN WELL Enterprises Co., Ltd.
MEAN WELL Enterprises Co., Ltd.
| Address(es) |
|
| Website | Not available |
| Status | MEMBER |
| Acceptance date | 2018-03-09 |
Further information
Stage | Country | Name |
|---|---|---|
2 | Denmark |
LEGEND: Scope Limitations
- RA : Audio amplifiers with audio power > 0,5 Watts excluded
- RC : Apparatus with connection(s) to a cable distribution system excluded
- RSH : Shredders excluded
- RT : Apparatus with connection(s) to a telecommunication network excluded
- RV : CRT (cathode ray tubes)/ picture tubes, plasma/LCD or other video apparatus excluded
- ROUT : Equipment intended for installation outdoors excluded
- RWPT : Wireless power transmitter excluded
Category | Name | Tests/Clauses | Acceptance Date | Responsible National Certification Body |
|---|---|---|---|---|
ITAV | IEC 62368-1:2018 | 4.7 EQUIPMENT FOR DIRECT INSERTION INTO MAINS SOCKETOUTLETS: MOMENT TEST5.2.2.1-5.2.2.6 Classification of Electrical Energy Sources 5.4.1.4, Annex B.2 MAXIMUM OPERATING TEMPERATURE FOR MATERIALS, COMPONENTS AND SYSTEMS5.4.1.8 DETERMINATION OF WORKING VOLTAGE5.4.1.10.3 BALL PRESSURE TEST5.4.2.4 MINIMUM CLEARANCE BASED UPON ELECTRIC STRENGTH TEST5.4.4.6.2 SEPARABLE THIN SHEET MATERIAL5.4.4.6.3, 5.4.4.6.4, 5.4.4.6.5 Non‐separable Thin Sheet Material 5.4.8 HUMIDITY CONDITIONING5.4.9.1 ELECTRIC STRENGTH TEST5.5.2.2 SAFEGUARDS AGAINST CAPACITOR DISCHARGE AFTER DISCONNECTION OF A CONNECTOR5.6.6.2(a), 5.6.6.2(b), 5.6.6.4.2(c), 5.6.6.4.2(d), 5.6.6.2(e) RESISTANCE OF THE PROTECTIVE BONDING SYSTEM5.7 PROSPECTIVE TOUCH VOLTAGE AND TOUCH CURRENT MEASUREMENT5.7.4 Touch Current Measurement – Unearthed Accessible Conductive Parts 5.7.5 Touch Current Measurement – Earthed Accessible Conductive Parts5.7.6 PROTECTIVE CONDUCTOR CURRENT6.2.2.2, 6.2.2.3 POWER MEASUREMENTS6.2.3.1 ARCING PIS DETERMINATION6.2.3.2 RESISTIVE PIS DETERMINATION6.3 NORMAL OPERATING CONDITIONS TEMPERATURE TEST8.8 HANDLE STRENGTHANNEX B.2.5 INPUT TEST: SINGLE PHASEANNEX B.2.5 INPUT TEST: POLYPHASEANNEX B.2.6 NORMAL OPERATING CONDITIONS TEMPERATURE MEASUREMENTANNEX B.3 SIMULATED ABNORMAL OPERATING CONDITIONSANNEX B.4 SIMULATED SINGLE FAULT CONDITIONSAnnex F.3.10 Test for The Permanence of Markings ANNEX G.5.3.3 / TRANSFORMER OVERLOADANNEX G.7.3.2 / STRAIN RELIEF TESTANNEX Q.1 / LIMITED POWER SOURCEANNEX T.2 (5.4.2.6, 5.4.3.2, G.15.2.6) / STEADY FORCE TEST, 10 NANNEX T.3 (4.4.3.2, 4.4.3.5, 5.3.2.3, G.15.2.6, U.3) / STEADY FORCE TEST, 30 NANNEX T.4 (4.4.3.2) / STEADY FORCE TEST, 100 NANNEX T.5 (4.4.3.2) / STEADY FORCE TEST, 250 NANNEX T.6 (4.4.3.4, 8.10.4) / ENCLOSURE IMPACT TESTANNEX T.7 (4.4.3.3) / DROP TESTANNEX T.8 (4.4.3.1, 4.4.3.8, 4.8.4.2, 8.6.1, 8.7.2, 8.10.6, G.7.3.2.4) / STRESS RELIEF TESTANNEX V.1 Accessible Parts of Equipment | 2020-04-16 | |
ITAV | IEC 62368-1:2014 | 5.2, 5.7 / CLASSIFICATION OF ELECTRICAL ENERGY SOURCES5.2.1.1 / ACCESSIBLE ES1 CIRCUITS SEPARATED FROM OTHER ES CIRCUITS USING COMPONENTS5.4.1.4, Annex B.2 / MAXIMUM OPERATING TEMPERATURE FOR MATERIALS, COMPONENTS AND SYSTEMS5.4.1.8 / DETERMINATION OF WORKING VOLTAGE5.4.1.10.3 / BALL PRESSURE TEST 5.4.4.6.2 / SEPARABLE THIN SHEET MATERIAL5.4.4.6.4, 5.4.4.6.5 Non‐separable Thin Sheet Material 5.4.8 / HUMIDITY CONDITIONING5.4.9 / ELECTRIC STRENGTH TEST5.5.2.2 / SAFEGUARDS AGAINST CAPACITOR DISCHARGE AFTER DISCONNECTION OF A CONNECTOR 5.6.6.2(a), 5.6.6.2(b), 5.6.6.4.2(c), 5.6.6.4.2(d), 5.6.6.2(e) / RESISTANCE OF THE PROTECTIVE BONDING SYSTEM5.7 / PROSPECTIVE TOUCH VOLTAGE AND TOUCH CURRENT MEASUREMENT5.7.5 / PROTECTIVE CONDUCTOR CURRENT6.2.2.2, 6.2.2.3 / POWER MEASUREMENTS6.3 / NORMAL OPERATING CONDITIONS TEMPERATURE TESTB.2.5 – INPUT TEST: SINGLE PHASEB.2.5 – INPUT TEST: POLYPHASEANNEX B.2.6 / NORMAL OPERATING CONDITIONS TEMPERATURE MEASUREMENTANNEX B.3 / SIMULATED ABNORMAL OPERATING CONDITIONSANNEX B.4 / SIMULATED SINGLE FAULT CONDITIONSANNEX F.3.10 / TEST FOR THE PERMANENCE OF MARKINGSANNEX G.5.3.3 / TRANSFORMER OVERLOADANNEX G.7.3.2 / STRAIN RELIEF TESTANNEX Q.1 / LIMITED POWER SOURCEANNEX T.2 (5.4.2.6, 5.4.3.2, G.15.3.6) / STEADY FORCE TEST, 10 NANNEX T.3 (4.4.4.2, 4.4.4.5, 5.3.2.3, G.15.3.6, U.3) / STEADY FORCE TEST, 30 NANNEX T.4 (4.4.4.2) / STEADY FORCE TEST, 100 NANNEX T.5 (4.4.4.2) / STEADY FORCE TEST, 250 NANNEX T.6 (4.4.4.4, 8.10.4) / ENCLOSURE IMPACT TESTANNEX T.7 (4.4.4.3) / DROP TESTANNEX T.8 (4.4.4.1, 4.4.4.7, 4.8.4.2, 8.6.1, 8.7.2, 8.10.6, G.7.3.2.4) / STRESS RELIEF TEST | 2019-04-10 | |
MED | IEC 60601-1:2005 | 4.11 Power Input5.7Humidity Conditioning8.4.2Limitation of Voltage, Current or Power8.4.3Voltage or Charge Limitation8.5.4Working Voltage Measurements8.6.4 aImpedance and Current Carrying Capability8.7Leakage Current Tests8.7.4.5Earth Leakage Current8.7.4.6Touch Leakage Current8.7.3 e)Non-Frequency-Weighted Leakage Current8.8.3Dielectric Voltage Withstand8.8.4.1Ball Pressure11Temperature13Abnormal Operation Testing15.3.2Enclosure Force15.3.3Enclosure Impact15.3.4Drop Impact15.3.6Mold Stress Relief15.5.1.2Transformer Short Circuit15.5.1.3Transformer Overload | 2024-12-11 | |
MED | IEC 60601-1:2005/AMD1:2012 | 4.11 Power Input5.7Humidity Conditioning8.4.2Limitation of Voltage, Current or Power8.4.3Voltage or Charge Limitation8.5.4Working Voltage Measurements8.6.4 aImpedance and Current Carrying Capability8.7Leakage Current Tests8.7.4.5Earth Leakage Current8.7.4.6Touch Leakage Current8.7.3 e)Non-Frequency-Weighted Leakage Current8.8.3Dielectric Voltage Withstand8.8.4.1Ball Pressure11Temperature13Abnormal Operation Testing15.3.2Enclosure Force15.3.3Enclosure Impact15.3.4Drop Impact15.3.6Mold Stress Relief15.5.1.2Transformer Short Circuit15.5.1.3Transformer Overload | 2024-12-11 | |
MED | IEC 60601-1:2005/AMD2:2020 | 4.11 Power Input5.7Humidity Conditioning8.4.2Limitation of Voltage, Current or Power8.4.3Voltage or Charge Limitation8.5.4Working Voltage Measurements8.6.4 aImpedance and Current Carrying Capability8.7Leakage Current Tests8.7.4.5Earth Leakage Current8.7.4.6Touch Leakage Current8.7.3 e)Non-Frequency-Weighted Leakage Current8.8.3Dielectric Voltage Withstand8.8.4.1Ball Pressure11Temperature13Abnormal Operation Testing15.3.2Enclosure Force15.3.3Enclosure Impact15.3.4Drop Impact15.3.6Mold Stress Relief15.5.1.2Transformer Short Circuit15.5.1.3Transformer Overload | 2024-12-11 | |
OFF | IEC 60950-1:2005 | All clauses except as below: 2.1.1.9, 2.3.1, 2.3.4, 2.3.5, 2.10.3.9, 2.10.4, 2.10.5.4, 2.10.7, 2.10.8.2, 2.10.8.4, 3.2.5.1, 3.2.8, 4.2.8, 4.3.6, 4.3.8, 4.3.12, 4.3.13.2, 4.3.13.3, 4.3.13.4, 4.3.13.5.1, 4.3.13.5.2, 4.5.5, 4.6.2, 4.6.4.2, 4.6.5, 4.7.3, 4.7.3.6, 5.3.6, 6.2.1, 6.2.2.1, 7.3, 7.4.2, 7.4.3, Annex A, Annex H, Annex M, Annex N, Annex Q, Annex R, Annex S, Annex T, Annex U, Annex Y, Annex AA, Annex CC, Annex DD and Annex EE | 2021-08-07 | |
OFF | IEC 60950-1:2005/AMD1:2009 | All clauses except as below: 2.1.1.9, 2.3.1, 2.3.4, 2.3.5, 2.10.3.9, 2.10.4, 2.10.5.4, 2.10.7, 2.10.8.2, 2.10.8.4, 3.2.5.1, 3.2.8, 4.2.8, 4.3.6, 4.3.8, 4.3.12, 4.3.13.2, 4.3.13.3, 4.3.13.4, 4.3.13.5.1, 4.3.13.5.2, 4.5.5, 4.6.2, 4.6.4.2, 4.6.5, 4.7.3, 4.7.3.6, 5.3.6, 6.2.1, 6.2.2.1, 7.3, 7.4.2, 7.4.3, Annex A, Annex H, Annex M, Annex N, Annex Q, Annex R, Annex S, Annex T, Annex U, Annex Y, Annex AA, Annex CC, Annex DD and Annex EE | 2021-08-07 | |
OFF | IEC 60950-1:2005/AMD2:2013 | All clauses except as below: 2.1.1.9, 2.3.1, 2.3.4, 2.3.5, 2.10.3.9, 2.10.4, 2.10.5.4, 2.10.7, 2.10.8.2, 2.10.8.4, 3.2.5.1, 3.2.8, 4.2.8, 4.3.6, 4.3.8, 4.3.12, 4.3.13.2, 4.3.13.3, 4.3.13.4, 4.3.13.5.1, 4.3.13.5.2, 4.5.5, 4.6.2, 4.6.4.2, 4.6.5, 4.7.3, 4.7.3.6, 5.3.6, 6.2.1, 6.2.2.1, 7.3, 7.4.2, 7.4.3, Annex A, Annex H, Annex M, Annex N, Annex Q, Annex R, Annex S, Annex T, Annex U, Annex Y, Annex AA, Annex CC, Annex DD and Annex EE | 2021-08-07 |