G.E.W. China Manufacturing Co., Ltd. DEKRA-061
G.E.W. China Manufacturing Co., Ltd. DEKRA-061
Address(es) |
|
Website | Not available |
Status | MEMBER |
Acceptance date | 2012-11-08 |
Further information
Stage | Country | Name |
---|---|---|
1 | Netherlands |
LEGEND: Scope Limitations
- RA : Audio amplifiers with audio power > 0,5 Watts excluded
- RC : Apparatus with connection(s) to a cable distribution system excluded
- RSH : Shredders excluded
- RT : Apparatus with connection(s) to a telecommunication network excluded
- RV : CRT (cathode ray tubes)/ picture tubes, plasma/LCD or other video apparatus excluded
- ROUT : Equipment intended for installation outdoors excluded
- RWPT : Wireless power transmitter excluded
Category | Name | Tests/Clauses | Acceptance Date | Responsible National Certification Body |
---|---|---|---|---|
HOUS | IEC 60335-1:2020 | All clauses except clause 8.1.4, 12, 14, 15.1, 19.11.4, 21.2, 22.3, 22.5, 22.16, 22.32, 22.47, 22.48, 30, 32.2, Annex B, Annex E, Annex F, Annex H, Annex J, Annex N, Annex P, Annex R, Annex T, Annex U | 2023-04-13 | |
HOUS | IEC 60335-1:2010 | All clauses except clause 8.1.4, 14, 15.1, 19.11.4, 21.2, 22.3, 22.5, 22.16, 22.32, 22.47, 22.48,30, Annex E, Annex F, Annex H, Annex J, Annex N, Annex P, Annex R, Annex T | 2018-09-13 | |
HOUS | IEC 60335-1:2010/AMD1:2013 | All clauses except clause 8.1.4, 14, 15.1, 19.11.4, 21.2, 22.3, 22.5, 22.16, 22.32, 22.47, 22.48,30, Annex E, Annex F, Annex H, Annex J, Annex N, Annex P, Annex R, Annex T | 2018-09-13 | |
HOUS | IEC 60335-1:2010/AMD2:2016 | All clauses except clause 8.1.4, 14, 15.1, 19.11.4, 21.2, 22.3, 22.5, 22.16, 22.32, 22.47, 22.48,30, Annex E, Annex F, Annex H, Annex J, Annex N, Annex P, Annex R, Annex T | 2018-09-13 | |
HOUS | IEC 60335-1:2001/AMD2:2006 | All except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields tes, cl 19.11.4.4. surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl. 22.32 oxygen bomb test, ceramic test 22.46 (annex R) software evalution, 22.48 prevent backsiphonage test, annex J Coated printed circuit boards test | 2012-11-08 | |
HOUS | IEC 60335-2-9:2008 | All clauses except for induction hotplate and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-9:2008/AMD1:2012 | All clauses except for induction hotplate and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-9:2008/AMD2:2016 | All clauses except for induction hotplate and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-9:2002/AMD2:2006 | All except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields tes, cl 19.11.4.4. surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl. 22.32 oxygen bomb test, ceramic test 22.46 (annex R) software evalution, 22.48 prevent backsiphonage test, annex J Coated printed circuit boards test | 2012-11-08 | |
HOUS | IEC 60335-2-14:2016 | All clauses other than exception tests of IEC 60335-1 | 2019-10-10 | |
HOUS | IEC 60335-2-14:2016/AMD1:2019 | All clauses other than exception tests of IEC 60335-1 | 2019-10-10 | |
HOUS | IEC 60335-2-14:2006 | All clauses other than exception tests of IEC 60335-1 | 2012-11-08 | |
HOUS | IEC 60335-2-14:2006/AMD1:2008 | 2012-11-08 | ||
HOUS | IEC 60335-2-15:2012 | All clauses except the exception tests of IEC 60335-1 | 2019-09-26 | |
HOUS | IEC 60335-2-15:2012/AMD1:2016 | All clausesAll clauses except the exception tests of IEC 60335-1 | 2019-09-26 | |
HOUS | IEC 60335-2-15:2012/AMD2:2018 | All clauses except the exception tests of IEC 60335-1 | 2019-09-26 | |
HOUS | IEC 60335-2-48:2021 | All clauses except clause 8, 15, 23, 30 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-48:2002 | All clauses except clause 8, 15, 23, 30 and exception tests of IEC 60335-1 | 2012-11-08 | |
HOUS | IEC 60335-2-48:2002/AMD1:2008 | All clauses except clause 8, 15, 23, 30 and exception tests of IEC 60335-1 | 2012-11-08 | |
HOUS | IEC 60335-2-48:2002/AMD2:2017 | All clauses except clause 8, 15, 23, 30 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-64:2021 | All clauses except clause15, 20, 23 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-64:2002 | All clauses except clause15, 20, 23 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-64:2002/AMD1:2007 | All clauses except clause15, 20, 23 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-64:2002/AMD2:2017 | All clauses except clause15, 20, 23 and exception tests of IEC 60335-1 | 2023-04-13 | |
HOUS | IEC 60335-2-75:2012 | All clauses except clause 11.101, 15, 22.110, annex AA and exception tests of IEC 60335-1 | 2018-01-04 | |
HOUS | IEC 60335-2-75:2012/AMD1:2015 | All clauses except clause 11.101, 15, 22.110, annex AA and exception tests of IEC 60335-1 | 2018-01-04 | |
HOUS | IEC 60335-2-75:2012/AMD2:2018 | All clauses except clause 11.101, 15, 22.110, annex AA and exception tests of IEC 60335-1 | 2019-09-26 |