Daikin Research & Development Malaysia Sdn. Bhd. (DRDM)
Daikin Research & Development Malaysia Sdn. Bhd. (DRDM)
| Address(es) |
|
| Website | https://www.daikinmalaysia.com/drdm/ |
| Acceptance date | 2024-02-29 |
| Accredited by | STANDARDS MALAYSIA,STANDARDS MALAYSIA |
| Certificates | |
| Contacts | Contacts
|
Responsible National Certification Body
Name | Country |
|---|---|
Malaysia |
Also operating under the following NCBs
No information declared
LEGEND: Scope Limitations
- RA : Audio amplifiers with audio power > 0,5 Watts excluded
- RC : Apparatus with connection(s) to a cable distribution system excluded
- RSH : Shredders excluded
- RT : Apparatus with connection(s) to a telecommunication network excluded
- RV : CRT (cathode ray tubes)/ picture tubes, plasma/LCD or other video apparatus excluded
- ROUT : Equipment intended for installation outdoors excluded
- RWPT : Wireless power transmitter excluded
Category | Standard | Scope limitation | Acceptance date | Responsible National Certification Body |
|---|---|---|---|---|
EMC | CISPR 14-1:2020 | 2024-02-29 | ||
EMC | CISPR 14-1:2016 | 2024-02-29 | ||
EMC | CISPR 14-1:2005 | 2024-02-29 | ||
EMC | CISPR 14-1:2005/AMD1:2008 | 2024-02-29 | ||
EMC | CISPR 14-1:2005/AMD2:2011 | 2024-02-29 | ||
EMC | CISPR 14-2:2020 | 2024-02-29 | ||
EMC | CISPR 14-2:2015 | 2024-02-29 | ||
EMC | CISPR 14-2:1997 | 2024-02-29 | ||
EMC | CISPR 14-2:1997/AMD1:2001 | 2024-02-29 | ||
EMC | CISPR 14-2:1997/AMD2:2008 | 2024-02-29 | ||
EMC | IEC 61000-3-2:2018 | 2024-02-29 | ||
EMC | IEC 61000-3-2:2018/AMD1:2020 | 2024-02-29 | ||
EMC | IEC 61000-3-2:2014 | 2024-02-29 | ||
EMC | IEC 61000-3-3:2013 | 2024-02-29 | ||
EMC | IEC 61000-3-3:2013/AMD1:2017 | 2024-02-29 | ||
EMC | IEC 61000-3-3:2013/AMD2:2021 | 2024-07-10 | ||
EMC | IEC 61000-3-11:2017 | 2024-02-29 | ||
EMC | IEC 61000-3-11:2000 | 2024-02-29 | ||
EMC | IEC 61000-3-12:2011 | 2024-02-29 | ||
EMC | IEC 61000-3-12:2011/AMD1:2021 | 2024-07-10 | ||
EMC | IEC 61000-4-2:2008 | 2024-02-29 | ||
EMC | IEC 61000-4-3:2020 | 2024-02-29 | ||
EMC | IEC 61000-4-3:2006 | 2024-02-29 | ||
EMC | IEC 61000-4-3:2006/AMD1:2007 | 2024-02-29 | ||
EMC | IEC 61000-4-3:2006/AMD2:2010 | 2024-02-29 | ||
EMC | IEC 61000-4-4:2012 | 2024-02-29 | ||
EMC | IEC 61000-4-5:2014 | 2024-02-29 | ||
EMC | IEC 61000-4-5:2014/AMD1:2017 | 2024-02-29 | ||
EMC | IEC 61000-4-6:2013 | 2024-02-29 | ||
EMC | IEC 61000-4-11:2020 | 2024-02-29 | ||
EMC | IEC 61000-4-11:2004 | 2024-02-29 | ||
EMC | IEC 61000-4-11:2004/AMD1:2017 | 2024-02-29 | ||
EMC | IEC 61000-6-1:2016 | 2024-02-29 | ||
EMC | IEC 61000-6-1:2005 | 2024-02-29 | ||
EMC | IEC 61000-6-2:2016 | 2024-02-29 | ||
EMC | IEC 61000-6-2:2005 | 2024-02-29 | ||
EMC | IEC 61000-6-3:2020 | 2024-03-01 | ||
EMC | IEC 61000-6-3:2006 | 2024-02-29 | ||
EMC | IEC 61000-6-3:2006/AMD1:2010 | 2024-02-29 | ||
EMC | IEC 61000-6-4:2018 | 2024-02-29 | ||
EMC | IEC 61000-6-4:2006 | 2024-02-29 | ||
EMC | IEC 61000-6-4:2006/AMD1:2010 | 2024-02-29 | ||
HOUS | IEC 60335-1:2010 | 2024-02-29 | ||
HOUS | IEC 60335-1:2010/AMD1:2013 | 2024-02-29 | ||
HOUS | IEC 60335-1:2010/AMD2:2016 | 2024-02-29 | ||
HOUS | IEC 60335-1:2001 | 2024-02-29 | ||
HOUS | IEC 60335-1:2001/AMD1:2004 | 2024-02-29 | ||
HOUS | IEC 60335-1:2001/AMD2:2006 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2018 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2013 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2013/AMD1:2016 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2002 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2002/AMD1:2005 | 2024-02-29 | ||
HOUS | IEC 60335-2-40:2002/AMD2:2005 | 2024-02-29 | ||
HOUS | IEC 60335-2-65:2002 | 2024-02-29 | ||
HOUS | IEC 60335-2-65:2002/AMD1:2008 | 2024-02-29 | ||
HOUS | IEC 60335-2-65:2002/AMD2:2015 | 2024-02-29 | ||
HOUS | IEC 60335-2-80:2015 | 2024-02-29 |