Eaton Corporation
Eaton Corporation
| Address(es) | |
| Website | Not available |
| Status | MEMBER |
| Acceptance date | 2023-02-15 |
Further information
Stage | Country | Name |
|---|---|---|
2 | Germany |
LEGEND: Scope Limitations
- RA : Audio amplifiers with audio power > 0,5 Watts excluded
- RC : Apparatus with connection(s) to a cable distribution system excluded
- RSH : Shredders excluded
- RT : Apparatus with connection(s) to a telecommunication network excluded
- RV : CRT (cathode ray tubes)/ picture tubes, plasma/LCD or other video apparatus excluded
- ROUT : Equipment intended for installation outdoors excluded
- RWPT : Wireless power transmitter excluded
Category | Name | Tests/Clauses | Acceptance Date | Responsible National Certification Body |
|---|---|---|---|---|
ITAV | IEC 62368-1:2018 | B.1.5; B.2.5; B.3; B.4; F.3.9; G.5.3.3; G.5.4; G.7.3; G.7.6.2.2; J.2.2; 5.3.2; 5.4.1.4; 5.4.1.4.2; 5.4.1.8; 5.4.1.10.3; 5.4.4.6.2; 5.4.8; 5.4.9; 5.4.10.3; 5.4.11; 5.5.2.2; 5.6.6.2; 5.6.6.3; 5.7; 6.3; 6.5.3; 8.6; 8.7; 8.11; Annex K; Annex Q; Annex T | 2023-02-15 | |
ITAV | IEC 62368-1:2014 | B.1.6; B.2.3; B.2.5; B.3; B.4; B.4.8; F.3.9; G.5.3.3; G.5.4; G.7.3; G.7.6.2.2; J.2.2; 5.3.2; 5.4.1.4; 5.4.1.4.2; 5.4.1.8; 5.4.1.10.3; 5.4.4.6.2; 5.4.8; 5.4.9; 5.4.10.3; 5.4.11; 5.5.2.2; 5.6.6.2; 5.6.6.3; 5.7; 6.3; 6.5.3; 8.6; 8.7; 8.11; Annex K; Annex Q; Annex T | 2023-02-15 | |
MED | IEC 60601-1:2005 | Clause 4.11 Power inputClause 5.7 Humidity preconditioning treatmentClause 7.1.2 Legibility of markings:Clause 7.1.3 Durability of markingsClause 8.4 Limitation of voltage, current, or energyClause 8.6.4 Impedance and current-carryingcapabilityClause 8.7.4.5 Earth leakage currentClause 8.7.4.6 Touch currentClause 8.8.3 Dielectric strengthClause 8.8.4.1 Mechanical strength and resistance to heatClause 8.9 Creepage distances and Air clearanceClause 9.4.2 Instability – overbalanceClause 11.1 Excessive temperatures in MEequipmentClause 11.6.6 Cleaning and disinfectionClause 11.8 Interruption of the powersupply/supply mainsClause 13 Single fault conditionsClause 15.3 Mechanical strength (Push, Impact, Drop, Mould Stress relief) | 2023-05-10 | |
MED | IEC 60601-1:2005/AMD1:2012 | Clause 4.11 Power inputClause 5.7 Humidity preconditioning treatmentClause 7.1.2 Legibility of markings:Clause 7.1.3 Durability of markingsClause 8.4 Limitation of voltage, current, or energyClause 8.6.4 Impedance and current-carryingcapabilityClause 8.7.4.5 Earth leakage currentClause 8.7.4.6 Touch currentClause 8.8.3 Dielectric strengthClause 8.8.4.1 Mechanical strength and resistance to heatClause 8.9 Creepage distances and Air clearanceClause 9.4.2 Instability – overbalanceClause 11.1 Excessive temperatures in MEequipmentClause 11.6.6 Cleaning and disinfectionClause 11.8 Interruption of the powersupply/supply mainsClause 13 Single fault conditionsClause 15.3 Mechanical strength (Push, Impact, Drop, Mould Stress relief) | 2023-05-10 | |
MED | IEC 60601-1:2005/AMD2:2020 | Clause 4.11 Power inputClause 5.7 Humidity preconditioning treatmentClause 7.1.2 Legibility of markings:Clause 7.1.3 Durability of markingsClause 8.4 Limitation of voltage, current, or energyClause 8.6.4 Impedance and current-carryingcapabilityClause 8.7.4.5 Earth leakage currentClause 8.7.4.6 Touch currentClause 8.8.3 Dielectric strengthClause 8.8.4.1 Mechanical strength and resistance to heatClause 8.9 Creepage distances and Air clearanceClause 9.4.2 Instability – overbalanceClause 11.1 Excessive temperatures in MEequipmentClause 11.6.6 Cleaning and disinfectionClause 11.8 Interruption of the powersupply/supply mainsClause 13 Single fault conditionsClause 15.3 Mechanical strength (Push, Impact, Drop, Mould Stress relief) | 2023-05-10 | |
MED | IEC 60601-1-6:2010 | Process standard only, no testing | 2023-05-10 | |
MED | IEC 60601-1-6:2010/AMD1:2013 | Process standard only, no testing | 2023-05-10 | |
MED | IEC 60601-1-6:2010/AMD2:2020 | Process standard only, no testing | 2023-05-10 | |
OFF | IEC 60950-1:2005 | 1.6.2; 1.7.11; 2.1.1.1; 2.1.1.3; 2.1.1.4; 2.1.1.5; 2.1.1.6; 2.1.1.7; 2.1.1.8; 2.1.2; 2.2; 2.3.1; 2.3.4; 2.3.5; 2.4.1; 2.5; 2.6.3.4; 2.7; 2.8; 2.9.2; 2.10.2; 3.1.4; 3.2.6; 4.1; 4.2.2; 4.2.3; 4.2.4; 4.2.5; 4.2.6; 4.2.7; 4.2.10; 4.3.2; 4.3.8; 4.5.1; 4.5.5; 5.1; 5.2; 5.3; 6.1.2; 6.2; 6.3, Annex B; Annex C; Annex DD | 2023-02-15 | |
OFF | IEC 60950-1:2005/AMD1:2009 | 1.6.2; 1.7.11; 2.1.1.1; 2.1.1.3; 2.1.1.4; 2.1.1.5; 2.1.1.6; 2.1.1.7; 2.1.1.8; 2.1.2; 2.2; 2.3.1; 2.3.4; 2.3.5; 2.4.1; 2.5; 2.6.3.4; 2.7; 2.8; 2.9.2; 2.10.2; 3.1.4; 3.2.6; 4.1; 4.2.2; 4.2.3; 4.2.4; 4.2.5; 4.2.6; 4.2.7; 4.2.10; 4.3.2; 4.3.8; 4.5.1; 4.5.5; 5.1; 5.2; 5.3; 6.1.2; 6.2; 6.3, Annex B; Annex C; Annex DD | 2023-02-15 | |
OFF | IEC 60950-1:2005/AMD2:2013 | 1.6.2; 1.7.11; 2.1.1.1; 2.1.1.3; 2.1.1.4; 2.1.1.5; 2.1.1.6; 2.1.1.7; 2.1.1.8; 2.1.2; 2.2; 2.3.1; 2.3.4; 2.3.5; 2.4.1; 2.5; 2.6.3.4; 2.7; 2.8; 2.9.2; 2.10.2; 3.1.4; 3.2.6; 4.1; 4.2.2; 4.2.3; 4.2.4; 4.2.5; 4.2.6; 4.2.7; 4.2.10; 4.3.2; 4.3.8; 4.5.1; 4.5.5; 5.1; 5.2; 5.3; 6.1.2; 6.2; 6.3, Annex B; Annex C; Annex DD | 2023-02-15 | |
OFF | IEC 62040-1:2008 | 2.10.5.7; 3.3.8; 4.6; 4.7; 5.1; 5.2; 5.2.1; 5.2.2; 5.2.3; 5.2.4; 5.2.5; 5.3; 5.5; 5.6; 5.7; 6.0; 7.2; 7.3; 7.6; 7.7; 8.1; 8.2; 8.3; Annex B; Annex I; Annex M | 2023-02-15 | |
OFF | IEC 62040-1:2008/AMD1:2013 | 2.10.5.7; 3.3.8; 4.6; 4.7; 5.1; 5.2; 5.2.1; 5.2.2; 5.2.3; 5.2.4; 5.2.5; 5.3; 5.5; 5.6; 5.7; 6.0; 7.2; 7.3; 7.6; 7.7; 8.1; 8.2; 8.3; Annex B; Annex I; Annex M | 2023-02-15 |