Bridgepower Corp.
Bridgepower Corp.
Address(es) |
|
Website | Not available |
Status | WITHDRAWN |
Acceptance date | 2017-11-03 |
Further information
Stage | Country | Name |
---|---|---|
2 | Denmark | |
2 | Denmark |
LEGEND: Scope Limitations
- RA : Audio amplifiers with audio power > 0,5 Watts excluded
- RC : Apparatus with connection(s) to a cable distribution system excluded
- RSH : Shredders excluded
- RT : Apparatus with connection(s) to a telecommunication network excluded
- RV : CRT (cathode ray tubes)/ picture tubes, plasma/LCD or other video apparatus excluded
- ROUT : Equipment intended for installation outdoors excluded
- RWPT : Wireless power transmitter excluded
Category | Name | Tests/Clauses | Acceptance Date | Responsible National Certification Body |
---|---|---|---|---|
MED | IEC 60601-1:2005 | 4.11 Power Input5.7 Humidity Conditioning5.9.2 Determination of Accessible Parts7.1.2 Legibility of Markings7.1.3 Durability of Markings78.4.3 Voltage or Charge Limitation8.6.4 a Impedance and Current Carrying Capability8.7 Leakage Current Tests8.7.4.5 Earth Leakage Current8.7.4.6 Touch Leakage Current8.8.3 Dielectric Voltage Withstand8.8.4.1 Ball Pressure8.11.3.5 Cord Anchorage11 Temperature11.6.6 Cleaning and Disinfection11.8 Interruption of the Power Supply13 Abnormal Operation Testing13.1.2 Power Availability13.2 Impairment of Cooling15.3.2 Enclosure Force15.3.3 Enclosure Impact15.3.4 Drop Impact15.3.5 Rough Handling15.3.6 Mold Stress Relief | 2019-08-01 | |
MED | IEC 60601-1:2005/AMD1:2012 | 4.11 Power Input5.7 Humidity Conditioning5.9.2 Determination of Accessible Parts7.1.2 Legibility of Markings7.1.3 Durability of Markings78.4.3 Voltage or Charge Limitation8.6.4 a Impedance and Current Carrying Capability8.7 Leakage Current Tests8.7.4.5 Earth Leakage Current8.7.4.6 Touch Leakage Current8.8.3 Dielectric Voltage Withstand8.8.4.1 Ball Pressure8.11.3.5 Cord Anchorage11 Temperature11.6.6 Cleaning and Disinfection11.8 Interruption of the Power Supply13 Abnormal Operation Testing13.1.2 Power Availability13.2 Impairment of Cooling15.3.2 Enclosure Force15.3.3 Enclosure Impact15.3.4 Drop Impact15.3.5 Rough Handling15.3.6 Mold Stress Relief | 2019-08-01 | |
MED | IEC 60601-1:2005/AMD2:2020 | 4.11 Power Input5.7 Humidity Conditioning5.9.2 Determination of Accessible Parts7.1.2 Legibility of Markings7.1.3 Durability of Markings78.4.3 Voltage or Charge Limitation8.6.4 a Impedance and Current Carrying Capability8.7 Leakage Current Tests8.7.4.5 Earth Leakage Current8.7.4.6 Touch Leakage Current8.8.3 Dielectric Voltage Withstand8.8.4.1 Ball Pressure8.11.3.5 Cord Anchorage11 Temperature11.6.6 Cleaning and Disinfection11.8 Interruption of the Power Supply13 Abnormal Operation Testing13.1.2 Power Availability13.2 Impairment of Cooling15.3.2 Enclosure Force15.3.3 Enclosure Impact15.3.4 Drop Impact15.3.5 Rough Handling15.3.6 Mold Stress Relief | 2022-06-23 |