CTF

Allan International Holding Ltd.

 
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Standards in Scope

Category
Standard
Tests/Clauses
Acceptance Date
Responsible National Certification Body(s)
HOUSIEC 60335-1:2010/AMD1:2013
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-8:2012
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-9:2002/AMD2:2006
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-13:2002/AMD1:2004
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-14:2006/AMD2:2012
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-15:2002/AMD2:2008
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-23:2003/AMD2:2012
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18
HOUSIEC 60335-2-32:2002/AMD2:2013
Except for the cl 15.1.1 IP code, cl 19.11.4.2 radiated fields test, cl 19.11.4.4 surge test, cl 19.11.4.5 injected currents test, cl22.1 degrees of protection against enter of dust cl 22.32 oxygen bomb test, ceramic test, 22.46(annex R) Software evaluation,22.48 prevent backsiphonage test,annex J Coated printed circuit boards test
2016-08-18